iPod MKII - Adding Data Transfer to PCB
Advanced Modification — Please Read Before Proceeding
The Boxy Pixel MKII board supports USB data transfer when three additional wires are soldered between the MKII board and the iPod logic board.
This is an advanced modification intended only for users experienced with fine-pitch soldering and working with small electronic components. This guide is provided for reference only. Installation assistance, troubleshooting, and damage resulting from this modification are outside the scope of our technical support.
Disconnect the battery and all power sources before beginning. Carefully verify every connection before applying power. Reversing or bridging connections may damage the MKII board, the iPod logic board, or connected USB devices.
1. Locate D+ and D− on the MKII Board
The MKII board includes connections for D+, D−, and VBUS (+5V). The D+ and D− solder points are shown below and are marked with white and yellow dots.
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2. Locate VBUS on the MKII Board
The VBUS connection supplies +5V. Its location is labeled “VBUS” on the MKII board and is marked with a red dot below.
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3. Connect D+ and D− to the iPod Logic Board
Solder the MKII board’s D+ and D− connections to the corresponding locations on the iPod logic board, as shown below. Make sure D+ connects to D+ and D− connects to D−.

4. Connect VBUS to the iPod Logic Board
Solder a wire from the VBUS solder point on the Boxy Pixel MKII board to the appropriate +5V location on your iPod logic board.
The VBUS location differs between the 5th-generation, 5.5-generation, and 6th/7th-generation iPod logic boards. Use the image that matches your board and verify the board version before soldering.
5th-generation iPod:

5.5-generation iPod:

6th- and 7th-generation iPod:

Before Applying Power
Inspect all solder joints for bridges, loose strands, or incorrect connections. Use a multimeter to check for shorts between VBUS and ground before reconnecting the battery or USB cable. Secure the wires so they cannot move, become pinched, or place stress on the solder pads during final assembly.